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Use this section for MCM/Hybrid testing,
qualification and monitoring requirements.
Class H is the recommended class for the “normal” and
“severe” environments. Requirements for Class H can be found in MIL-PRF-38534.
Equivalent test data, monitors, or historical records may be used when available
and approved by the approval activity of the application.
Conditions and methods of test should
be in accordance with MIL-STD-883 or equivalent JEDEC test methods. Other test
methods or circuits may be substituted if such a substitution in no way relaxes
the requirements. A system for control and calibration of test equipment should
be established. If a manufacturer elects to eliminate or reduce all or any
conformance, qualification or screening step by substituting a process monitor
or SPC procedure, they should only be relieved of the responsibility of
performing that step only. The manufacturer should still be responsible for
providing microcircuits, which meet all of the performance, quality, and
reliability requirements for the application.
Element evaluation is used to
verify that procured materials and devices meet their specified characteristics
and are adequate to perform as intended under the conditions experienced in the
application. Element characteristics required assuring device performance and
assembly process capability should be identified. These evaluations should be
completed on all materials before their use in production devices. These
evaluations may be modified by the manufacturer based on:
Element quality and reliability history.
Device quality and reliability history.
e. Possible impact
of element evaluation failure after assembly.
elements may be assembled into the device before final element lot acceptance.
However, the hybrid manufacturer should have a system approved to maintain
traceability of all such elements for purposes of recall. This system should be
employed only when a work stoppage situation is encountered, or when a lengthy
test is required. Element evaluation will be successfully completed before
Microcircuit and semiconductor dice from each wafer
lot should be evaluated in accordance with MIL-PRF-38534 appendix C Table C-II
and Chapter 3.3.1 through Chapter 184.108.40.206. For Class H devices, element
evaluation testing is not required for JANHC or JANKC discrete semiconductors,
which have been tested in accordance with MIL-PRF-19500.
Passive elements from each inspection lot will be
evaluated in accordance with MIL-PRF-38534 appendix C Table C-III and Chapter
3.4.1 through Chapter 3.4.6. This evaluation is not required when the elements
are acquired from the Established Reliability series of military specifications
and is listed on the QPL.
SAW elements will be evaluated in accordance with
MIL-PRF-38534 appendix C Table C-IV and Chapter 3.5.1 through Chapter
Alternate element evaluation should be used
only in cases where full device performance cannot be adequately ascertained
outside the actual end item (e.g., hybrid microcircuit RF component). The sample
built into devices should successfully complete evaluation before release of the
balance of the incoming lot. In lieu of packaged element evaluation tests,
elements may be assembled into devices and screened per Mil-PRF-38534 appendix
Table C-IX through final electrical. Acceptance of these elements should be
based on the ability of the device to meet all group A, subgroups 1, 2, and 3
(plus 4, 7, and 9, as applicable) electrical tests required for the device. A
minimum of 10 elements or 100% of the elements, whichever is less, (0 defects)
should be assembled into at least 3 devices. Devices assembled for the purpose
of element evaluation are deliverable, provided all of the provisions of this
specification are met. Element wire bond evaluation for elements may be
accomplished using a second or additional sample of elements wire bonded for
that purpose only. When the device build option for evaluation is selected, the
manufacturer should establish and maintain a sample plan or procedure to
identify the sample prior to electrical test. In case of lot failure when
alternative element evaluation is used, all the device samples and the
inspection lot will be rejected. When
the manufacturer chooses to analyze the failed devices to isolate the cause of
failure and this analysis determines that the cause of failure is not related to
the element being tested and that the element has been correctly stressed during
the required screening and testing, then the inspection lot may be accepted. If
the element has not been correctly stressed, the failed device may be reworked
or new sample replacement devices may be assembled.
Substrates should be evaluated in accordance with
MIL-PRF-38534 appendix C Table C-V and Chapter 3.7.1 through Chapter
NOTE: Substrates fabricated by
the device manufacturer using a qualified process will be exempt from this
Package cases or covers should be evaluated in
accordance with MIL-PRF-38534 appendix C Table C-VI and Chapter 3.8.1 through
Chapter 3.8.5. In addition, laser marked surfaces should be subjected to and
pass subgroups 3, 5, and 6 of Table C-VI.
Integral Substrate/Packages (ISP) should be evaluated
in accordance with MIL-PRF-38534 Table C-VII and Chapter 3.9.1 through Chapter
The polymeric adhesives used in device applications
should be subjected to and pass the evaluation procedures detailed in