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Use this section to control the environment the
parts are used in and in establishing procedures to safeguard the parts.
Moisture
sensitivity
Moisture inside a plastic device turns to steam and
expands rapidly when the package is exposed to the high temperature of vapor
phase reflow, infrared soldering, or, if the package is submerged in molten
solder, wave soldering. Under certain conditions, the pressure from this
expanding moisture can cause internal delamination of the plastic from the chip,
internal cracks that do not extend to the outside of the package, bond damage,
wire necking, bond lifting, thin film cracking, or cratering beneath the bonds.
In the most severe case, the stress can result in external package cracks. This
is commonly referred to as the “popcorn” phenomenon because the internal stress
causes the package to bulge and often crack with an audible “pop”.
ESD
Parts must be properly protected during test-handling
insertion and all stages of manufacturing. The metal oxide semiconductor (MOS)
technology used in high-impedance input stages is quite sensitive to ESD. Precautions against ESD are simple. First,
store the parts in a fixture that shorts all the leads together. Second, the
circuits must be handled with care, preferably by ESD trained personnel who are
grounded by a ground strap during work operations. To reduce ESD at the source,
assembly and test areas should not be carpeted. The moisture in the air should
be regulated at a 40 or 50 percent humidity level. Soldering irons should be
designed to prevent electric potential to be collected or generated at the tip
during use. Grounded soldering tips may be required. Equipment containing these
sensitive parts should not be handled while wires are still handing loose. The ESD section in the
Library provides background information relative to the impact of ESD charges on
part reliability.
Temperature
sensitivity
Plastic parts have limited operating
temperature capability (typically
+159°C – the glass transition
temperature of most encapsulants) and for this reason must be protected from the
heat of soldering baths and soldering irons.
Plastic packages cannot give 100 percent protection to the parts against
various contamination liquids, so these parts must be sealed and stored in a
relatively dry and uncontaminated atmosphere. When active cleaning baths are
used as part of the assembly process, additional less active cleaning baths must
follow to remove all traces of the active cleaning baths, which may become a
source of destruction to the plastic part. Most plastic packages have a small
area on the end of the package through which the chip has been mounted. It is
electrically connected to the circuit, and proper precautions must prevent
bringing it into contact with any other
potential.