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This section describes qualification and monitoring requirements for Discrete Semiconductors. Use this section for Discrete Semiconductor qualification or monitoring requirements. 

General 

 

Test conditions and methods 

 

For testing, use MIL-STD-750 or equivalent JESD22 Test Methods. Other test methods or circuits may be substituted if such a substitution in no way relaxes the requirements. 

 

Eliminate or reduce test 

 

When a part manufacturer elects to eliminate or reduce a test or 100% screen, by substituting a process monitor or SPC, they are only relieved of the responsibility of performing the test or 100 % screen. They are still responsible for providing a product that meets the performance, quality, and reliability requirements for the application. A part reliability program (study) can replace all or any screening step or conformance inspection, when equivalent to or compliant with application reliability requirement. 

 

End-point electrical measurements 

 

Measure and record applicable (e.g., if deltas are required) end-point electrical measurements. Replace pre-test end point failures with acceptable parts. Perform end-point measurements before 96 hours unless specified.   

 

Rework 

 

Rework of sealed packages shall be limited to re-cleaning, re-branding to correct defective marking and lead straightening, re-plating or re-solder dipping of the leads.  After any re-plating, devices shall pass as a 100 percent screen the requirements of Group A, subgroup 2 (DC static-tests at 25°C) and the hermetic seal requirements (fine/gross leak) of MIL-PRF-19500 and MIL-STD-750. In addition, rework shall be limited to the following for wafers: additional etch to correct a nonconformance to a specification limit; photoresist strip and recoat; additional processing to continue or finish incomplete processing; strip and redeposit of non-junction passivation or backside metallization. 

 

Die and Chips 

 

Die and chips used in “normal” or “severe” environments shall meet the minimal requirements for the JANHC level of QML-19500.

Part Monitoring 

 

Parts used in the “normal” and “severe” environment shall have conformance testing or equivalent monitoring performed. Non-military parts shall meet the MIL-PRF-19500 and/or the minimum application requirement. Recommend using process control monitors for test and screen elimination. The manufacturer shall have a process that meets or exceeds the requirements of groups A, B, and C of MIL-PRF-19500. 

Part Qualification 

 

When designing-in and/or qualifying Discrete Semiconductors for “normal” or “severe” environments use the MIL-PRF-19500, JANTX level, as a minimum. Qualification requirements for Plastic Discrete Semiconductors are in Table 1

. Plastic parts used in the “normal” environment shall pass the requirements in Table 1,

as a minimum.  

Table 1. Qualification Requirements for Plastic Discrete Semiconductors